Tata Electronics has signed a memorandum of understanding (MoU) with ASMPT Singapore to develop cutting-edge semiconductor assembly equipment for its chip packaging units in Assam and Karnataka. This partnership will drive the creation of advanced semiconductor assembly and testing facilities in Vemagal and Jagiroad.
The collaboration will focus on enhancing automation, research and development in wire bonding, flip-chip technology, and advanced packaging. It also includes workforce training and strengthening service engineering infrastructure, enabling Tata Electronics to provide state-of-the-art semiconductor assembly solutions in India.
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Aimed at building a robust semiconductor infrastructure, the partnership will support the establishment of high-tech assembly and testing units in Vemagal, Karnataka, and Jagiroad, Assam. This effort is expected to boost India’s semiconductor ecosystem while advancing technology innovation and industry standards.
The initiative will also focus on sustainable growth, prioritising energy and material efficiency, which will fortify India’s semiconductor supply chain. By doing so, the partnership aims to promote a thriving, eco-friendly semiconductor ecosystem in India, ensuring long-term, sustainable development.
Tata Electronics is investing ₹1,18,000 crore in two significant projects: a semiconductor fab in Dholera, Gujarat, and an Outsourced Semiconductor Assembly and Test (OSAT) facility in Jagiroad, Assam. This expansion is expected to generate nearly 50,000 direct and indirect jobs, contributing to India’s growing semiconductor industry.
